Heat sink for integrated-circuit chip carrier



FIG. 1 is a perspective view of a heat sink for integrated-circuit chipcarrier showing my new design, the broken lines being shown forillustrative purposes only;

FIG. 2 is a perspective view thereof, omitting the broken lines forclarity of disclosure;

FIG. 3 is a side elevational view thereof, looking upwardly toward theright in relation to the heat sink as it is shown in FIG. 1;

FIG. 4 is a side elevational view thereof, looking upwardly toward theleft in relation to the heat sink as it is shown in FIG. 1;

FIG. 5 is a top plan view thereof; and

FIG. 6 is a bottom plan view thereof.

The ornamental design for a heat sink for integrated-circuit chipcarrier, substantially as shown and described.